Systems and methods for conforming test tooling to integrated circuit device profiles with convex support structure

ABSTRACT

A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a continuation-in-part and claims benefit of U.S. applicationSer. No. 13/975,50 filed on Aug. 23, 2013, entitled “Systems and Methodsfor Conforming Test Tooling to Integrated Circuit Device Profiles withEjection Mechanisms”, which is a continuation-in-part and claims benefitof U.S. application Ser. No. 13/935,439 filed on Jul. 3, 2013, entitled“Systems and Methods for Conforming Test Tooling to Integrated CircuitDevice Profiles with Compliant Pedestals”, which is acontinuation-in-part and claims benefit of U.S. application Ser. No.13/830,633 filed on Mar. 14, 2013, entitled “Systems and Methods forConforming Device Testers to Integrated Circuit Device Profiles withFeedback Temperature Control”, which is a continuation-in-part andclaims benefit of U.S. application Ser. No. 13/562,305 filed on Jul. 30,2012, entitled “Systems and Methods for Conforming Device Testers toIntegrated Circuits Device Profiles”, which is a continuation-in-partand claims benefit of U.S. application Ser. No. 13/081,439 filed on Apr.6, 2011, entitled “Systems and Methods for Thermal Control of IntegratedCircuits during Testing”, which in turn is a continuation-in-part andclaims benefit of U.S. application Ser. No. 12/957,306 filed on Nov. 30,2010, entitled “Improved Thermal Control Unit Used to Maintain theTemperature of IC Devices Under Test”, (now U.S. Pat. No. 8,508,245)which claims benefit of U.S. Provisional Patent Application Ser. No.61/265,285 filed Nov. 30, 2009, all applications are hereby fullyincorporated by reference.

BACKGROUND

The present invention generally relates to the testing of IC devicessuch as packaged semiconductor chips (also referred to as packageddies), and more particularly relates to device testers configured toconform to the shape of integrated circuit (IC) devices under test(DUTs).

Conventional integrated circuit devices include a die, incorporating theIC, attached a substrate. The die is bonded electrically (e.g. solder)and physically (e.g. epoxy) to the top of the substrate, at an elevatedtemperature sufficient to melt solder and to cure the epoxy.

Initially, before they are bonded to each other, both the substrate andthe die are flat. However as illustrated by the simplified andexaggerated cross-sectional view (not to scale) of FIG. 12A, during thecooling process after heated bonding process, device 1280A becomesslightly curved (slightly bowed like the top of a mushroom) because of amismatch of expansion and contraction coefficients of the die and thesubstrate.

The curvature of the device at room temperature (after cooling) shouldnot be a problem because during the assembly of the device to amotherboard, at the elevated reflow temperature (sufficient to meltsolder paste) inside a surface mount technology (SMT) reflow oven, thereheated device should become substantially flat again, thereby ensuringsatisfactory electrical bonds between the device pads and themotherboard contacts.

Ideally, the curvature of the device should be preserved prior toassembly to the motherboard. However, these devices need to be testedfor proper functionality at different temperatures prior to assembly tothe motherboard. Typical device testers are designed with the assumptionthat the devices under test (DUTs) are flat. As a consequence, the flatprofiles of the pedestal, the substrate pusher and the test socketresult in undue pressure being exerted on the curved DUT, especially onthe die, during testing.

This undue pressure problem is exacerbated by the existence of othercomponents, in addition to the die, on the same substrate. So in atypical tester, the pedestal and the substrate pusher only contact thedie and the perimeter of the substrate, respectively, leaving theremaining surface of the substrate, where the other components reside,unsupported.

As a result, after testing the surface of the device is somewhatflattened due to the undue pressure from the pedestal and the pusher,and often uneven, due to the uneven pressure between the supported andunsupported surfaces of the DUT. FIG. 12B is a simplified andexaggerated cross-section view (not to scale) of one such exemplarypost-testing uneven, e.g., wavy, device 1280B.

Hence there is an urgent need for improved device tester designs that donot unduly deform the DUTs, especially for devices with thinnersubstrates needed for manufacturing compact portable electronic devicessuch as smart phones and tablets.

SUMMARY

To achieve the foregoing and in accordance with the present invention,systems and methods for testing of IC devices such as packagedsemiconductor chips, while conforming to the shape of the IC deviceunder test (DUT).

In one embodiment, an IC device tester configured to maintain a setpoint temperature on the DUT having a substrate having a die attached toan upper surface thereof, and also configured to conform to the profileof the DUT. The device tester includes a thermal control unit and a testsocket assembly.

The thermal control unit includes a pedestal assembly with aheat-conductive pedestal having a bottom end configured to contact thedie of the DUT, a temperature-control fluid circulation block, athermally-conductive heater having a fuse coupled to a heating element,a substrate pusher configured to contact the substrate of the DUT, and acontrollable force distributor for receiving a z-axis force andcontrollably distribute such z-axis force between the pedestal assemblyand the substrate pusher. The test socket assembly includes a testsocket operatively coupled to a socket insert for supporting the DUT.The socket insert has a shaped profile substantially conforming to acorresponding profile of the DUT.

In some embodiments, the test socket assembly has an elevator mechanismthat includes a plurality of spring-loaded suspension support pins forsupporting the socket insert. The test socket assembly may also includea plurality of spring-loaded test pins. The support pins enable the testpins to be withdrawn while in a rest condition and further enable thetest pins to protrude during a test condition.

In a further embodiment, the test socket assembly has at least onecompliant pedestal configured to facilitate the testing of integratedcircuits where the DUT comprises a substrate having multiple IC chipswith different testing requirements in terms of forces applied andtemperatures of testing.

In yet a further embodiment, a substrate pusher assembly is providedwith ejection mechanisms to facilitate the disengagement of the DUT atthe end of the test. One example of the ejection mechanisms is toprovide the substrate pusher assembly with spring-loaded pins that pushthe substrate of the DUT away from the pedestal at the end of the test.Another example of the ejection mechanisms is to use a pressurized fluidto push the substrate of the DUT away from the pedestal at the end ofthe test.

In yet a further embodiment, A convex testing stack useful inassociation with a thermal control unit (TCU) that may be used tomaintain a set point temperature for testing of a convex IC device undertest (DUT) is configured to preserve the convex shape of the DUT.

Note that the various features of the present invention described abovemay be practiced alone or in combination. These and other features ofthe present invention will be described in more detail below in thedetailed description of the invention and in conjunction with thefollowing figures.

BRIEF DESCRIPTION OF THE DRAWINGS

In order that the present invention may be more clearly ascertained,some embodiments will now be described, by way of example, withreference to the accompanying drawings, in which:

FIG. 1 is a side view of an exemplary thermal control unit that includesa z-axis force balancing mechanism in accordance with one aspect of theinvention;

FIG. 2 is a cross-sectional view thereof taken along section lines 2-2in FIG. 1;

FIG. 3 is another cross-sectional view thereof taken along section lines3-3 in FIG. 2;

FIG. 4 is a bottom perspective view of the z-axis load distributoractuator block of the z-axis force distribution system of the TCU shownin FIGS. 1-4;

FIG. 5 is a cross-sectional view of the load distributor actuator blockshown in FIG. 4 along the line 5-5, in combination with a spring loadedgimbal;

FIG. 6 is a side view of another exemplary embodiment of a thermalcontrol unit in accordance with the present invention;

FIG. 7A is cross-sectional view thereof taken along section lines 7A-7Ain FIG. 6, while FIG. 7B is an exploded view of FIG. 7A;

FIG. 8 is another cross-sectional view thereof taken along section lines8-8 in FIG. 7A;

FIG. 9 is another cross-sectional view thereof taken along section lines9-9 in FIG. 7A;

FIG. 10A is a bottom perspective view of an exemplary z-axis loaddistributor actuator block for the z-axis force distribution system ofthe TCU 600 shown in FIGS. 6-9;

FIG. 10B is a bottom perspective view of an alternative embodiment ofthe z-axis load distributor actuator block of FIG. 10A;

FIG. 11 is a cross-sectional view of the load distributor actuator blockshown in FIG. 10A along the line 11-11, in combination with a springloaded gimbal;

FIG. 12A is a cross-sectional view of a slightly curved IC device priorto testing;

FIG. 12B is a cross-sectional view of an IC device deformed by testing;

FIGS. 13A and 13B are cross-sectional views illustrating embodiments ofa pedestal, a substrate pusher and the test socket in accordance withthe present invention;

FIGS. 13C and 13D are cross-sectional views of additional embodiments ofthe test socket inserts;

FIG. 13E is a perspective view of the test socket and test socket insertfor the embodiment of FIG. 13A;

FIGS. 13F and 13G are cross-sectional views illustrating a suspensionpin and a test pin for the embodiment of FIG. 13A, in rest condition andtest condition, respectively;

FIGS. 14A-14D are a front view, a top view, a perspective view and ablown-up view illustrating an exemplary fused heater in accordance withsome embodiments of the present invention;

FIGS. 15A and 15B are perspective and exploded views of anotherexemplary embodiment of a thermal control unit (TCU) in accordance withthe present invention;

FIGS. 16A and 16B are perspective and exploded views of the FlowManagement System (FMS) in accordance with the present invention;

FIGS. 17A and 17B are perspective and exploded views of the Thermal HeadUnit (THU);

FIGS. 17C and 17D are perspective views of the gimbal module;

FIG. 17E is a perspective views of the heater assembly;

FIGS. 17F, 17G, and 17H are perspective and exploded views of the DeviceKit Module;

FIG. 171 is a perspective view of the inner structure of the heatexchanger plate (cold plate);

FIGS. 17J and 17K are top view and a cross-sectional view along the line17K-17K for the thermal head unit (THU);

FIG. 18 is a perspective view of the flexible cable chain assembly;

FIGS. 19A and 19B are perspective and exploded views of the thermalcontrol unit (TCU) with the dry boxes for condensation abatement;

FIG. 20 shows a simplified multi-chip substrate having two IC chips;

FIG. 21 is a perspective view of a pedestal assembly;

FIG. 22 is an exploded view of a compliant pedestal;

FIG. 23 shows a top view of the pedestal assembly;

FIG. 24A is a cross-sectional view of the pedestal assembly along theline 24A-24A in FIG. 23;

FIG. 24B is a cross-sectional view of the pedestal assembly along theline 24B-24B in FIG. 23;

FIG. 24C is a cross-sectional view of the pedestal assembly along theline 24C-24C in FIG. 23;

FIG. 25 shows a perspective view of a substrate pusher assembly with aset of ejection pins;

FIG. 26 is an exploded view of the substrate pusher assembly with theset of ejection pins;

FIG. 27 is a top view of the substrate pusher assembly with the set ofejection pins;

FIG. 28A is a cross-sectional view of the substrate pusher assembly withthe set of ejection pins along the line A-A in FIG. 27;

FIG. 29 shows a perspective view of a substrate pusher assembly with aset of ejection nozzles;

FIG. 30 is an exploded view of the substrate pusher assembly with theset of ejection nozzles;

FIG. 31 is a top view of the substrate pusher assembly with the set ofejection nozzles;

FIG. 32A is a cross-sectional view of the substrate pusher assembly withthe set of ejection nozzles along the line A-A in FIG. 31;

FIG. 33 shows a Device Under Test (DUT) with different curvature shapes;

FIG. 34A depicts a conventional testing stack in a TCU for testing IC;

FIG. 34B illustrates an explode view of a conventional testing stack ina TCU for testing IC;

FIG. 35 is a representation of convex curvatures of the DUT in both thex-direction as well as the y-direction;

FIG. 36A illustrates an explode view of a convex testing stack in a TCUfor testing IC; and

FIG. 36B depicts a convex testing stack in a TCU for testing IC.

DETAILED DESCRIPTION

Aspects, features and advantages of exemplary embodiments of the presentinvention will become better understood with regard to the followingdescription in connection with the accompanying drawing(s). It should beapparent to those skilled in the art that the described embodiments ofthe present invention provided herein are illustrative only and notlimiting, having been presented by way of example only. All featuresdisclosed in this description may be replaced by alternative featuresserving the same or similar purpose, unless expressly stated otherwise.Therefore, numerous other embodiments of the modifications thereof arecontemplated as falling within the scope of the present invention asdefined herein and equivalents thereto. Hence, use of absolute terms,such as, for example, “will,” “will not,” “shall,” “shall not,” “must,”and “must not,” are not meant to limit the scope of the presentinvention as the embodiments disclosed herein are merely exemplary.

Before describing the present invention in detail, it is to beunderstood that the invention is not limited to the TCU illustratedherein. It is also to be understood that the terminology used herein isfor describing particular embodiments only, and is not intended to belimiting.

In addition, as used in this specification and the appended claims, thesingular article forms “a,” “an,” and “the” include both singular andplural referents unless the context of their usage clearly dictatesotherwise. Thus, for example, reference to “a piston” includes aplurality of springs as well as a single piston, reference to “anoutlet” includes a single outlet as well as a collection of outlets, andthe like.

In general, the invention relates to thermal control units (TCUs) thatmay be used to maintain a set point temperature on an IC device undertest (DUT). The TCU can suitably include features common to thosedescribed in U.S. Pat. No. 7,663,388, which is incorporated herein byreference. Such features would include, in a z-axis stacked arrangement,a heat-conductive pedestal for contacting the DUT and containing athermal sensor, a fluid circulation block, and a thermoelectric module(a Peltier device) or heater between the heat-conductive pedestal andthe fluid circulation block for pumping heat away from the DUT and intothe fluid circulating block (or for pumping heat into DUT). The commonfeatures would also include in the z-stack arrangement a spring loadedpusher mechanism for exerting a z-axis force compliant force that holdsthe fluid block, thermoelectric module (or heater) and heat conductingpedestal tightly together.

The present invention also relates to systems and methods for testing ofIC devices such as packaged semiconductor chips (also referred to aspackaged dies) while preserving the devices' original specifications,especially with respect to the IC devices physical characteristic.

The TCUs in accordance with the invention may be used on DUTs ofdifferent constructions. For example, the TCU may be used with ICdevices having a lidded package that employs an integrated heat spreader(IHS) or with IC devices having a bare die chip package.

One aspect of the invention is directed to TCUs having different pushersused to push against different parts of a chip package. In this aspectof the invention, a z-axis load distribution system is provided forcontrollably distributing the total z-axis force applied to from the topof the TCU between different pushers so that a desired balance can beachieved for the exerted by the different pushers. For example, when adie pusher/pedestal and a substrate pusher are used in conjunction withbare die chip packages, the z-axis forces applied the diepusher/pedestal can be adjusted relative to with the pushing forceapplied by the substrate pusher to balance the loads on the die andsubstrate of the bare die package.

In another and separate aspect of the invention, at least one andpreferably both the fluid inlet and/or fluid outlet for the fluidcirculation block are swivelable, preferably about a swivel axis that issubstantially perpendicular to the z-axis of the TCU. The swivelcapability of the fluid inlet and outlet acts to reduce instability ofthe thermal control unit in response to z-axis movement of thetemperature-control fluid block.

In a further and separate aspect of the invention, a means for abatingcondensation is provided. Such means includes a condensation-abating gasinlet and condensation-abating gas transporting passageways in thethermal control unit near surfaces of the thermal control unit on whichcondensation may occur.

An exemplary embodiment of a TCU in accordance with the invention isillustrated by FIGS. 1-5.

The thermal control unit 1 includes the following basic sectionsarranged in stacked relationship along the z-axis of the TCU: a forcetransmitting section 10 for transmitted a z-axis force denoted by thearrow F in FIG. 1 to the TCU's DUT contacting pushers as hereinafterdescribed; an inner spring loaded pusher block section 40; a fluidcirculation block section 50; a thermoelectric module (hereinafterPeltier device) section 60; and a heat conductive pedestal section 72having a pusher end 76, which contains a temperature sensor 78, forcontacting and pushing against a thermally active central portion of anIC chip, such as the die 104 of a bare die chip package 100. An outerpusher structure is also provided. This pusher structure, denoted by thenumeral 80, includes a rigid bottom pusher plate 81 and is suitablyfabricated of a metal material, such as aluminum, for rigidity. Thebottom pusher plate has a center opening to allow the pusher end of theheat conducting pedestal to project through the pusher plate. A secondDUT contacting pusher 82 extends from the bottom of the pusher platearound this center opening. This second pusher extends in the z-axisdirection in parallel with the pusher end of the pedestal and contactsand pushes against another part of the IC chip, such as the substrate102 of the bare die chip package.

The outer pusher structure additional includes a skirt 90 secured aroundthe outer perimeter of the bottom pusher plate 81 and that extendsupward in the z-axis direction.

Referring to FIG. 3, the fluid circulation block section 50 is seen tohave a lower contact plate 58 at the bottom of block's main body 56.This lower contact plate is made of a good heat conductor such as copperand is suitable provided to achieve efficient heat conduction betweenthe fluid circulation block section and the thermoelectric module 60.The upper section 56 of the may be formed from material that does notconduct heat as well as copper or other metals.

The force transmitting section 10 of the TCU includes a forcedistribution block 12 and can additionally include a gimbal adapter 30above the force distribution block to form a gimbal. The gimbal adapter30 includes a top coupler part 32 having upper and lower surfaces 32 and34, with the upper surface of the coupler part being positioned toreceive the indicated z-axis force F. The gimbal adaptor furtherincludes springs 36 positioned beneath the lower surface of the topcoupler part of the gimbal adaptor at the corners of the coupler part.Springs 36 are held in compression between the adaptor's coupler partand the upper surface 16 of the force distribution block 12 for preloadgimbal stability.

As best seen in FIG. 2, the outer pusher structure is secured to theforce distribution block 12 by force transfer shafts 110. These shaftsfreely pass through suitably sized holes in the inner spring loadedpusher block and fluid circulation block sections 40, 50. The bottomends 113 of shafts 110 are suitably anchored to the pusher plate 81 nearthe outer perimeter of the plate, such as by threaded engagement, whilethe top ends 112 of the shafts extend through openings 20 (shown in FIG.4) in the corners of the force distribution block and are topped by capnuts 115, or any other captive mechanism that allows z-movement toretain the force distribution block on the shafts. As shown in FIG. 2,the force distribution block is compliantly supported on springs 117provided around the recessed portion of the shaft beneath the forcedistribution block and which set on shoulders 119 presented by therecessed portion of the shaft. A z-axis force F applied to the forcetransmitting section 10 will thus be compliantly transmitted to pusher82 of the outer pusher structure, and thus to the substrate 102 of baredie chip package 100. The springs can be used to pre-load the forcedistribution block to the inner pusher spring loaded block 40.

It is noted that bottom shoulders 121 are provided near the bottom end113 of each of the force transfer shafts 110. These shoulders restagainst the rigid pusher plate 81 to maintain the perpendicularity ofthe shafts.

The z-axis force F is transmitted to the die 104 of bare die chippackage 100 through the stacked thermal control sections of the TCU,namely, the inner spring loaded pusher block section 40, the fluidcirculation block section 50, the Peltier device 60, and the heatconductive pedestal section 72, all of which must be secured together.As best seen in FIG. 2, the fluid circulation block section 50 can bepre-attached to the inner pusher block section by suitable fastenerssuch as screw fasteners 41. A pedestal retainer ring 43 can be providedat the bottom of the stacked thermal control sections, and retainingfasteners, such as screw fasteners 45, can be used in conjunction withthis retainer ring to tie the pedestal 72 and the other thermal controlsections 40, 50 and 60 together. As generally described in U.S. Pat. No.7,663,388, this creates a stacked assemblage of thermal control sectionsheld in tight thermal contact with one another by the compliant z-axisforce exerted by springs (such as the spring 47 shown in FIG. 3)captured in the inner pusher block 40 behind the block's pusher plate49. As shown in FIG. 3, the pedestal 72 sets into retainer ring 43 ontop of insulation ring 73. This insulation ring can have notches orpassages that allow a condensation abatement gas to flow through theinsulation ring as hereinafter described.

The force transmitted to the pusher end of pedestal 72 is uniquelycontrolled by means in the force distribution block 12, which can beactuated to change the force transmitted to the thermally active part ofthe DUT through the pedestal relative to the force transmitted toanother part of the DUT through the outer pusher structure parts 80, 82.

Referring to FIGS. 4 and 5, the force changing actuation means for theforce distribution block can be provided in the form of at least one andpreferably a plurality of pistons 18 nested in bottom surface 14 of thez-axis force distribution block 12. Pistons 18, which are preferablyevenly spaced in a grouping centered in the bottom to the forcedistribution block 12, protrude from piston holes 17 in the bottom ofblock and can be actuated in the z-axis direction by altering fluidpressure behind the pistons. Fluid pressure is provided to the pistonsfrom inlet 22 which protrudes from a side wall 24 of the forcedistribution block 12.

As shown in FIG. 5, the inlet 22 fluidly communicates with the pistons18 via fluid passageways 25 within the force distribution block 12. Theinlet may be connected to a source of pressured gas or fluid to effectpneumatic actuation of the pistons. Although pressured air is typicallyused, the pressured fluid may be nongaseous as well. For example, oils,water, or aqueous solutions may be used to actuate the piston. Theresult is pistons that produce a z-axis force that can be adjusted onthe fly. By adjusting the pressures behind the pistons, the forcetransferred to the heat conducting pedestal 72 relative to the forcetransmitted to the outer pusher 82 can be modified during testing of theDUT without unloading or disassembling the thermal control unit.Alternatively, the adjustable pistons may be preset before use.

The z-axis force distribution block 12 can be constructed for ease ofloading the pistons 18 in the block by providing a top cover plate 13that fits in a recess 15 in the top surface 16 of the block. The topcover plate 16 can be secured in this recess by any suitable means suchas by screw fasteners. The fluid passageways that are in communicationwith the piston holes 17 can be formed on the underside of the block.The fluid inlet 22 can be a fluid line coupler attached, such as by athreaded attachment, to a fluid inlet extension 19 of top cover plate13.

The fluid circulation block 50 constructed fluid passages that enablefluids to be circulated through the block and carry heat away from thepedestal that contacts the thermally active part of the DUT, such asdescribed in U.S. Pat. No. 7,663,388. In accordance with one aspect ofthe invention, fluid is introduced into and is evacuated from the fluidcirculation block by fluid inlet and outlet arms 52, 54 swivelablyattached to the sides of the TCU generally at or near the position ofthe fluid circulation block. Swivel attachments to the fluid inlet andoutlet arms, in conjunction with compliant mounting of forcedistribution block 12 and the corner shafts 110, reduce instability ofthe thermal control unit due to external forces exerted on the TCU, andparticularly due to biasing forces exerted by external hoses connectedto the fluid inlet and outlet of the fluid circulation block. FIG. 1depicts the exemplary range of motion for the swivel attachment of fluidoutlet 54. The inlet and outlet arms preferably swivel about a commonswivel axis S (shown in FIG. 2), and suitably have a swivel axis that isperpendicular to the z-axis of the TCU. While the fluid inlet arm 52 andfluid outlet arm 54 are shown attached opposite each other on oppositesides of the TCU, it is not intended that this swivel arm attachmentaspect of the invention be limited to opposed swivel arms.

Thus, in accordance with this aspect of the invention, should anyuncontrolled forces arise from hoses connected to the fluid inlet andoutlet arms 52, 54 of the TCU, during a test cycle, the swivel action ofthe fluid inlet and outlet arms 52, 54 relative to the TCU will relievethese forces and cause z-axis alignment of the parts of the TCU to bemaintained.

Any of a number of fluids may be circulated through fluid circulationblock 50. Preferably, the fluids are provided in liquid form, butgaseous fluids may be used on occasion. Liquids having a relatively highheat capacity are particularly useful in certain application. Inaddition, the temperature-control fluids may be chosen according todesired conditions. For example, for testing of DUTs at ambient orelevated temperatures, e.g. 20° C. to about 65° C., water may serve as atemperature-control fluid. In contrast, cold testing of DUTs at −20° C.,−5° C., 0° C., or temperatures therebetween may involve the use ofaqueous solutions containing, methanol, ethylene glycol, or propyleneglycol or nonaqueous liquids.

In still another aspect of the invention the thermal control unit 1includes a condensation-abating system. The condensation-abating systemincludes a condensation-abating gas inlet 42, which can suitably belocated at one edge of the inner spring loaded pusher block section 40of the TCU. As shown in FIG. 3, gas inlet 42 connects to gastransporting passageways that extend around the pedestal 72, between thepedestal and the pedestal retaining ring 43, and between the pedestalretaining ring, pedestal and the outer pusher structure 80. The gastransporting passageways are denoted by the numerals 44A, 44B, 44C, 44D,46A, 46B and 47. The condensation-abating system in further describedbelow.

In use, the illustrated thermal control unit 1 may be placed over a testsocket (not shown) containing a bare die chip package 100. A z-axisforce is applied to the gimbal adapter 30, such as by a pneumatic pressof an automated chip tester. The z-axis force is transferred by theforce distribution block 12 of the self-centering gimbal 10 to pedestal72 through the stack of thermal control blocks 40, 50 and 60 to the heatconducting pedestal 72, and to the outer pusher structure 80 though theforce transfer shafts 110. The two pushers to which this z-axis force istransferred are the pusher end 76 of the pedestal which contacts the die104 of the bare die chip package and the substrate pusher 72 of theouter pusher structure. The exerted z-axis force is controllablydistributed between these pushers by the force distribution block 12.The force exerted on the die relative to the force exerted on thesubstrate can be adjusted by adjusting the pressure behind the pistons18 of the force distribution block, which acts a z-axis force actuationmeans. The force distribution may be preset or adjusted on the fly suchthat the die force does not exceed a desired or predetermined upperlimit to ensure that the die force does not damage the die.

It is noted that the z-axis distance between the pedestal pusher end 76and the bottom substrate pusher end 82 should be calibrated to ensurethe substrate force does not fall below a desire or predetermined lowerlimit to ensure proper engagement between electrical pads of the DUT andthe probes of the test socket. For example, a manufacturer of aparticular IC device in bare-die packaging may specify that theparticular IC device be cold tested with the application of at least a55 pound load to the substrate. However, the specification may alsoprohibit the die from experiencing a load of 15 pounds or greater. Insuch a case, a total load of 70 pounds may be applied to the DUT withthe die pusher adjusted to limit the load applied to the die not toexceed 15 pounds.

When so engaged, testing may begin. The thermal measurement and controlelements of the thermal control unit act to monitor and maintain theDUT's set point temperature. The DUT temperature may be monitored by thesensor 78 in the pedestal pusher end 76. A desired electrical signal issupplied to the Peltier device 60 from an external power source togenerate the heat flow needed to maintain a desired set pointtemperature for the DUT in the test socket. Heat transfer between thepedestal and fluid circulating block 50 can be regulated in accordancewith the temperature of the DUT as detected by the sensor 78, with heatbeing removed from the pedestal to the temperature-control fluid beingcirculated through the fluid block 50 when it is desired to lower theDUT temperature, and with heat being added to the pedestal 72 from thecirculating fluid if the DUT temperature needs to be raised. In short,the heat is either carried away or supplied by the temperature-controlfluid which is passed through the fluid passage within the fluidcirculating block 50.

To help achieve an efficient interface, a thermal interface material,such as a thermal grease or foil, is optionally provided between thepedestal's top surface 74 and the Peltier device 60, and between thePeltier device and the fluid circulating block 50.

Regarding the condensation-abatement aspect of the invention, the DUTsof the invention may be used to carry out cold testing of DUTs. Duringsuch cold testing, temperature-control fluid may be chilled totemperatures of 0° C. or below. If such testing is carried out underuncontrolled ambient conditions, water or ice may accumulate on surfaceof the TCUs, DUTs, and test sockets. Such condensation may short orotherwise interfere with the proper functioning of the electroniccomponents of TCUs, DUTs and test sockets.

A number of techniques known in the art have been used to address thecondensation problems associated with cold testing. For example,high-volume cold testing of IC devices have been carried out incontrolled environments, e.g., within rooms having a low level ofatmospheric humidity. In some low-volume cold testing facilities, ICdevices may be tested within an enclosure that maintains a low-humidity.In addition or in the alternative, plastic form of other material havinga low thermal conductivity may be applied to surfaces of TCUs to addresscondensation problems associated with the chilling of components of TCUsengaged in cold testing.

In accordance with the condensation abatement aspect of the invention,provides a new and efficient approach to abatement of condensation onTCU and chip surfaces, which is integrated into the TCU. Acondensation-abating gas is introduced under pressure into the TCUthrough gas inlet 42. The abating gas flushes through the TCU so as topass over surfaces on which condensation is likely to occur. Inparticular, in illustrated embodiment and as shown in FIG. 3 the gasintroduced at inlet 42 flows into horizontal passageway 44A and downthrough vertical passageway 44B and from there flushes throughpassageways 44C and 44D around the pedestal (including openings in thepedestal insulating ring 73), and exiting the TCU through two exitroutes: through passageways 46A, 46B between parts of the outer pusherstructure 80 and the pedestal retainer 43, which is preferably stainlesssteel, and through passageway 47 between the pusher end 76 of thepedestal 72 and the substrate pusher 82 of the outer pusher structure.

It will be appreciated that gas passageways may be provided in waysother than as shown. For example, passageway 44A extends generallyhorizontally through inner spring loaded pusher block 40 until it joinswith passageway 44B in a fluid-communicating manner. Passageway 44Bextends in a z-axis direction through a portion of block 40, as well asboth the upper section 56 and lower section 58 of the fluid circulationblock 50. Passageways 44C, 44D, 46A, 46B, and 47 are shown downstreamfrom passageway 44B and located between the skirt 90 and the pedestal72. Optionally, one or more additional passageways may be formed byplacing a first surface having one or more channels formed thereinagainst a second surface, the surfaces in combination defining the oneor more additional passageways. For example, condensation abating gastransporting passageways may be integrated within or interposed betweenthe modules of the inventive TCU.

In operation, a condensation-abating gas source (not shown) may beconnected with inlet 42. Condensation-abating gas is introduced throughthe inlet 42, and flushed through the gas passageways asabove-described, and flows over surfaces on which condensation mayoccur. As the pedestal 72 is necessarily cold during cold testing, skirt90 may help direct condensation-abating gas over exposed surfaces of thepedestal prone to collect moisture or ice.

Any of a number of gases may be used. For example, any dry inert gas,e.g., nitrogen, helium, argon, etc. may be used. In particular,commercially available, dry, oil-free air has been demonstrated to abatecondensation on the inventive TCU. TCUs having the above-describedintegrated means for abating condensation do not experiencecondensation-related problems during cold testing in uncontrolledatmospheric conditions, whereas the same TCU may suffer fromcondensation-related problems during cold testing when nocondensation-abating gas is used.

In addition to the use of condensation-abating gas, appropriate measuresshould be taken to address heat conduction issues. For example,different components of the temperature control unit should be thermallyisolated from one another whenever possible to inhibit chilling of watersensitive components of TCUs. In addition, material of low thermalconductivity should be used whenever possible. For example, metalsshould generally be avoided for components that do not have to conductheat. As discussed above, portions of the temperature-control fluidblock may be made from a metal such as copper for efficient heatconduction. However, other portions of the temperature-controlfluid-block, e.g., those exposed to the surrounding ambient environment,may be formed from a material that does not conduct heat, e.g., plastic,to deter the formation of condensation thereon.

To facilitate discussion, FIGS. 6-11 illustrate another exemplaryembodiment of a thermal control unit (TCU) 600 in accordance with thepresent invention. Advantages of this embodiment include a fast thermalresponse of 40° C./second for an IC device under test (DUT) have a testsurface area of approximately 16 mm×16 mm, with a resulting watt densityof approaching 1000 watts per square inch. In addition, TCU 600 has anoperating range of −60° C. to 160° C.

The superior thermal performance of TCU 600 is made possible by severalkey design features such as choices of thermal conductive materials,fluid and electrical pathways and thermal sensor locations, these designfeatures described in greater detail below. Briefly, FIG. 6 is a sideview of thermal control unit 600. FIG. 7A is cross-sectional viewthereof taken along section lines 7A-7A in FIG. 6, while FIG. 7B is anexploded view of FIG. 7B illustrating the components of TCU 600,including force transmitting assembly 610, fluid circulation block (heatexchanger with thermally-conductive plate) 650, heater 660, pedestal772, and substrate pusher 690. FIGS. 8 and 9 cross-sectional viewsthereof taken along section lines 8-8 and 9-9, respectively, in FIG. 7A.FIGS. 10A and 10B are bottom perspective views of two exemplary z-axisload distributor actuator blocks for the z-axis force distributionsystem of the TCU 600, while FIG. 11 is a cross-sectional view along theline 11-11 in FIG. 10A.

As shown in FIGS. 6-9, the thermal control unit (TCU) 600 includes thefollowing basic sections arranged in stacked relationship along thez-axis of the TCU 600: a force transmitting assembly 610 for transmitteda z-axis force denoted by the arrow F (see FIG. 6) to the TCU's ICdevice under test (DUT) contacting pushers as hereinafter described; afluid circulation block 650; a heater 660; and a heat conductivepedestal 772 having a pusher end 776, which includes at least onepedestal temperature sensor, for contacting and pushing against athermally active central portion of an IC chip, such as the die 799 of abare die chip package 797.

An outer pusher structure 780 is also provided. Pusher 780 includes arigid bottom pusher plate 781 and is suitably fabricated of a metalmaterial, such as aluminum, for rigidity. The bottom pusher plate 781has a center opening to allow the pusher end of the heat conductingpedestal to project through the pusher plate. A second DUT contactingpusher 682 extends from the bottom of the pusher plate around thiscenter opening. This second pusher 682 extends in the z-axis directionin parallel with the pusher end of the pedestal and contacts and pushesagainst another part of the IC chip, such as the substrate 798 of thebare die chip package 797.

Referring to FIG. 7A, the fluid circulation block (also known as thechiller block) 650 is seen to have a lower contact plate 758 at thebottom of block's main body 656. This lower contact plate 758 is made ofa good heat conductor such as copper and is suitable provided to achieveefficient heat conduction between the fluid circulation block 650 andthe heater 660. Hence the block's main body 656 of the may be formedfrom material that does not conduct heat as well as copper or othermetals. Suitable materials for main body 656 include thermoplastics suchas Peek™, Ultem™ or Torbn™, capable of withstanding repeated rapidthermal shock cycles and also reducing condensation abatement needs,during multiple rapid heating/cooling cycles of TCU 600.

To prevent thermal runaway and resulting damage to TCU 600, fluidcirculation block 650 preferably includes at least one chillertemperature sensor, enabling TCU 600 to sense when permitted operatingrange has been exceeded and triggering an appropriate thermal cut off.

Referring also to FIG. 6, the force transmitting assembly 610 of the TCU600 includes a force distribution block 612 and can additionally includea gimbal adapter 630 above the force distribution block 612 to form theforce transmitting assembly 610. The gimbal adapter 630 includes upperand lower surfaces 632 and 634, with the upper surface 632 beingpositioned to receive the indicated z-axis force F. The gimbal adaptor630 further includes springs 636 positioned beneath the lower surface634. Springs 636 are held in compression between the gimbal adaptor 630and the upper surface 616 of the force distribution block 612 forpreload gimbal stability.

As shown in FIGS. 7A, 7B, 9 and 10A, the outer pusher structure 780 issecured to the force distribution block 612 by force transfer shafts710. These shafts freely pass through suitably sized holes in the fluidcirculation block 650. The bottom ends 713 of shafts 710 are suitablyanchored to the pusher plate 781 near the outer perimeter of the plate,such as by threaded engagement, while the top ends 712 of the shaftsextend through openings 1020 (shown in FIG. 10A) in the corners of theforce distribution block and are topped by cap nuts 715 to retain theforce distribution block on the shafts 710.

In addition, gimbal block 612 also includes suitably sized holes 1077for coupling with a corresponding set of alignment pins 757 protrudingvertically from the top surface of fluid circulation block 650.

FIGS. 7A and 9 both show the force distribution block 612 compliantlysupported on springs 717 provided around the recessed portion of theshaft 710 beneath the force distribution block and which set onshoulders 719 presented by the recessed portion of the shaft 710. Az-axis force F applied to the force transmitting assembly 610 will thusbe compliantly transmitted to pusher 682 of the outer pusher structure,and thus to the substrate 798 of bare die chip package 797. The springs717 can be used to pre-load the force distribution block (gimbal block)612 to the main body 656 of fluid circulation block 650.

It is noted that bottom shoulders 721 are provided near the bottom end713 of each of the force transfer shafts 710. These shoulders restagainst the rigid pusher plate 781 to maintain the perpendicularity ofthe shafts.

The z-axis force F is transmitted to the die 799 of bare die chippackage 797 through the stacked thermal control sections of the TCU 600,namely, the fluid circulation block 650, heater 660, and the heatconductive pedestal 772, all of which must be secured together. Theforce transmitted to the pusher end of pedestal 772 is uniquelycontrolled by means in the force distribution block 612, which can beactuated to change the force transmitted to the thermally active part ofthe DUT through the pedestal relative to the force transmitted toanother part of the DUT through the outer pusher structure parts 780,682.

Referring to FIGS. 10A and 11, the force changing actuator for the forcedistribution block 612 (also known as the gimbal block), can be providedin the form of at least one and preferably a plurality of pistons 1018nested in bottom surface 1014 of a gimbal block 612 for distributing thez-axis force. Pistons 1018, which are preferably evenly spaced in agrouping centered in the bottom to the force distribution block 612,protrude from piston holes 1117 in the bottom of gimbal block 612 andcan be actuated in the z-axis direction by altering fluid pressurebehind the pistons 1018. Fluid pressure is provided to the pistons fromfluid inlet 622 which protrudes from a side wall 1024 of gimbal block612.

As shown in FIG. 11, the inlet 622 fluidly communicates with the pistons1018 via fluid passageway 1125 within the gimbal block 612. The inlet622 may be connected to a source of pressured gas or fluid to effectpneumatic actuation of the pistons 1018. Although pressured air istypically used, the pressured fluid may be nongaseous as well. Forexample, oils, water, or aqueous solutions may be used to actuate thepistons 1018. The result is pistons that produce a z-axis force that canbe adjusted on the fly. By adjusting the pressures behind the pistons1018, the force transferred to the heat conducting pedestal 772 relativeto the force transmitted to the outer pusher 682 can be modified duringtesting of the DUT without unloading or disassembling the thermalcontrol unit. Alternatively, the adjustable pistons may be preset beforeuse.

The gimbal block 612 can be constructed for ease of loading the pistons1018 in the block by providing a top cover plate 1113 that fits in arecess 1115 in the top surface 1116 of the block 612. The top coverplate 1113 can be secured in this recess 1115 by any suitable means suchas by screw fasteners. The fluid passageways that are in communicationwith the piston holes 1117 can be formed on the underside of the block612. The fluid inlet 622 can be a fluid line coupler attached, such asby a threaded attachment, to a fluid inlet extension 1119 of top coverplate 1113.

FIG. 10 b shows an alternate embodiment of the gimbal block 1012,wherein instead of machine screws, pivoted latches 1090 are used tosecure the stacked components of TCU 600 to each other without the needfor tools.

Referring to both FIGS. 6 and 7A, the fluid circulation block 650constructed fluid passages that enable fluids to be circulated throughthe block and carry heat away from the pedestal that contacts thethermally active part of the DUT, such as described in U.S. Pat. No.7,663,388. In accordance with one aspect of the invention, fluid isintroduced into and is evacuated from the fluid circulation block byfluid inlet and outlet arms 752, 654 swivelably attached to the sides ofthe TCU 600 generally at or near the position of the fluid circulationblock. Swivel attachments to the fluid inlet and outlet arms, inconjunction with compliant mounting of force distribution block 612 andthe corner shafts 710, reduce instability of the thermal control unitdue to external forces exerted on the TCU 600, and particularly due tobiasing forces exerted by external hoses connected to the fluid inletand outlet of the fluid circulation block. FIG. 6 depicts the exemplaryrange of motion for the swivel attachment of fluid outlet arm 654. Theinlet and outlet arms 752, 654 preferably swivel about a common swivelaxis S (shown in FIG. 7A), and suitably have a swivel axis that isperpendicular to the z-axis of the TCU 600. While the fluid inlet arm752 and fluid outlet arm 654 are shown attached opposite each other onopposite sides of the TCU 600, it is not intended that this swivel armattachment aspect of the invention be limited to opposed swivel arms.

Thus, in accordance with this aspect of the invention, should anyuncontrolled forces arise from hoses connected to the fluid inlet andoutlet arms 752, 654 of the TCU 600, during a test cycle, the swivelaction of the fluid inlet and outlet arms 752, 654 relative to the TCU600 will relieve these forces and cause z-axis alignment of the parts ofthe TCU to be maintained.

Any of a number of fluids may be circulated through fluid circulationblock 650. Preferably, the fluids are provided in liquid form, butgaseous fluids may be used on occasion. Liquids having a relatively highheat capacity are particularly useful in certain application. Inaddition, the temperature-control fluids may be chosen according todesired conditions. For example, for testing of DUTs at ambient orelevated temperatures, e.g. 20° C. to about 65° C., water may serve as atemperature-control fluid. In contrast, cold testing of DUTs at −20° C.,−5° C., 0° C., or temperatures therebetween may involve the use ofaqueous solutions containing, methanol, ethylene glycol, or propyleneglycol or nonaqueous liquids.

In still another aspect of the invention the thermal control unit (TCU)600 includes a condensation-abating system. During cold testing,temperature-control fluid may be chilled to temperatures of 0° C. orbelow. If such testing is carried out under uncontrolled ambientconditions, water or ice may accumulate on surface of the TCUs, DUTs,and test sockets. Such condensation may short or otherwise interferewith the proper functioning of the electronic components of TCUs, DUTsand test sockets.

Accordingly, the condensation-abating system includes acondensation-abating gas inlet 668, which can suitably be located at oneedge of the fluid circulation block 650. As shown in FIGS. 6 and 7A, gasinlet 668 connects to gas transporting passageways that extend aroundthe pedestal 772, in a manner similar to that of the other embodiment ofTCU 1 described above, thereby enabling the approach to abatement ofcondensation on TCU and chip surfaces, described above for TCU 1 to beintegrated into the TCU 600.

In addition to the use of condensation-abating gas, appropriate measuresshould be taken to address heat conduction issues. For example,different components of the temperature control unit should be thermallyisolated from one another whenever possible to inhibit chilling of watersensitive components of TCUs. In addition, material of low thermalconductivity should be used whenever possible. For example, metalsshould generally be avoided for components that do not have to conductheat. As discussed above, portions of the temperature-control fluidblock may be made from a metal such as copper for efficient heatconduction. However, other portions of the temperature-controlfluid-block, e.g., those exposed to the surrounding ambient environment,may be formed from a material that does not conduct heat, e.g., plastic,to deter the formation of condensation thereon.

In use, the illustrated thermal control unit 600 may be placed over atest socket (not shown) containing a bare die chip package 797. A z-axisforce is applied to the gimbal adapter 630, such as by a pneumatic pressof an automated chip tester. The z-axis force is transferred by theforce distribution block 612 of the self-centering gimbal 610 topedestal 772 through the stack of thermal control subassemblies 650 and660 to the heat conducting pedestal 772, and to the outer pusherstructure 780 though the force transfer shafts 710. The two pushers towhich this z-axis force is transferred are the pusher end 776 of thepedestal which contacts the die 798 of the bare die chip package 799 andthe substrate pusher 690 of the outer pusher structure.

The exerted z-axis force is controllably distributed between thesepushers by the force distribution block 612. The force exerted on thedie 799 relative to the force exerted on the substrate 798 can beadjusted by adjusting the pressure behind the pistons 1018 of the forcedistribution block, which acts a z-axis force actuation means. The forcedistribution may be preset or adjusted on the fly such that the dieforce does not exceed a desired or predetermined upper limit to ensurethat the die force does not damage the die 799. In other words, thetotal z-axis force exerted by force distribution block 612 is equal to asum of the force exerted on the substrate 798 and the force exerted onthe die 799. This force distribution between the substrate 798 and thedie 799 is carefully controlled so that no undue internal structuralstress, caused by harmful bending forces, is transmitted by the TCU 600to the DUT, while maintaining efficient thermal conductivity between theTCU 600 and the DUT during the test.

It is noted that the z-axis distance between the pedestal pusher end 776and the bottom substrate pusher end 682 should be calibrated to ensurethe substrate force does not fall below a desire or predetermined lowerlimit to ensure proper engagement between electrical pads of the DUT andthe probes of the test socket. For example, a manufacturer of aparticular IC device in bare-die packaging may specify that theparticular IC device be cold tested with the application of at least a55 pound load to the substrate 798. However, the specification may alsoprohibit the die 799 from experiencing a load of 15 pounds or greater.In such a case, a total load of 70 pounds may be applied to the DUT withthe die pusher 776 adjusted to limit the load applied to the die not toexceed 15 pounds.

When so engaged, testing may begin. The thermal measurement and controlelements of the thermal control unit act to monitor and maintain theDUT's set point temperature. The DUT temperature may be monitored by thepedestal thermal sensor in the pedestal pusher end 776.

A desired electrical current is supplied to the heater 660 from anexternal power source to generate the heat flow needed to maintain adesired set point temperature for the DUT in the test socket. Heattransfer between the pedestal 772 and fluid circulating block 650 can beregulated in accordance with the temperature of the DUT as detected bythe thermal sensor, with heat being removed from the pedestal 772 to thetemperature-control fluid being circulated through the fluid block 650when it is desired to lower the DUT temperature. It is also possible toadd supplement heat generated by the heater 660 to the pedestal 772 withadditional heat from the circulating fluid if the DUT temperature needsto be raised rapidly. In short, the heat is either carried away orsupplied by the temperature-control fluid which is passed through thefluid passage within the fluid circulating block 650.

As discussed above, although fluid circulating block 650 can be madefrom a suitable thermo-plastic to reduce condensation, while thethermally-conductive plate 758 is made from a relatively-thin (low-mass)and highly-conductive material, such as nickel-plated copper, forsuperior thermal transfer performance. Similarly, theelectrically-resistive heater 660 can be made from suitable materials,including ceramic materials such as AlN (aluminum nitride), which is hassuitable thermally-conductive properties.

To further improve the efficiency of the various thermal interfaces, asuitable thermal interface material, such as a thermal grease or foil,e.g., “Artic-Silver™ thermal compound, can be provided between thepedestal's top surface 774 the heater 660, and between the heater 660and the thermally-conductive plate 758 located at the bottom of fluidcirculating block 650. This thermal interface material, typically aboutone mil in thickness, fills out minor imperfections and voids, therebyenhancing thermal conductivity and efficiency of the respectiveinterfaces. In addition, the thermal interface material alsoaccommodates the different expansion coefficients of the correspondingcomponents made from different materials, namely, the plate 758, theheater 660 and the pedestal 772 during rapid heating and cooling cycles.

In some embodiments, in order to improve the thermal efficiency ofinterface between the pedestal pusher end 776 and the die 799, asuitable liquid thermal interface material (LTIM), for example water andglycerin, is injected under pressure into the pedestal/die interfacefrom one or more perforations located at the bottom of pedestal pusherend 776. Subsequently, after the testing of the DUT, residual LTIM isremoved under suction from the same bottom perforations of the pedestalpusher end 776. The LTIM is supplied to and removed from pedestal pusherend 776 via a corresponding set of LTIM input and output 669 shown inFIGS. 6 and 9.

As discussed above, typical device testers are designed with theassumption that the devices under test (DUTs) are flat. As aconsequence, the flat profiles of the pedestal, the substrate pusher andthe test socket result in undue pressure being exerted on curved DUTs,especially by the pedestal on the die, during testing. In addition, thepedestal and the substrate pusher exert pressure on the selected surfaceareas of the substrate. Hence, after testing, the surface of the deviceis somewhat flattened due to the undue pressure from the pedestal andthe pusher, and often uneven, due to the uneven pressure between thesupported and unsupported surfaces of the DUT.

The uneven pressure problem on the DUTs can be partially mitigated byintroducing adjustable touchdown coverage that attempts to increase thesupported top surface area of the DUTs. This is accomplished byproviding additional surface support between the pedestal and thesubstrate pusher, i.e., on the surrounding components surrounding thedie on the substrate, such as resistors, capacitors and I/O drivers.However, the adjustable touchdown coverage does not solve the moreserious, undesirable and unintended device flattening problem.

The device flattening problem becomes more pronounced as the substratethickness decreases. With today's portable devices, device substratethicknesses have steadily decreased from about 800 microns to about100-200 microns. Unlike thicker, e.g., 800 microns, devices, capable ofresuming its original curvature after being flattened by the devicetester, today thinner devices are much more likely to become permanentlydeformed as exemplified by device 1280B of FIG. 12B.

To minimize this undesirable flattening problem, in some embodiments ofthe device testers, as illustrated by FIG. 13A (not to scale), thepedestal 1360, the substrate pusher 1370 and the socket insert 1392 oftest socket 1390 are configured to accommodate the curved device 1380.Accordingly, the pusher end 1366 of pedestal 1360 is slighted concave inorder to substantially match the curvature of the surface of die 1384 ofdevice 1380. Similarly, the top surface of socket insert 1392 isslightly convex in order to substantial match the curvature of thebottom of substrate 1380 of device 1380.

For illustrative purposes, FIG. 13B is a simplified and exaggerated (notto scale) cross-sectional view showing in greater detail the respectivecurved profiles of pedestal pusher end 1366, die 1384, substrate pusherends 1372, 1374, substrate 1382, and socket insert 1392.

Hence, depending on the sizes and thicknesses of the DUTs, widevariations of curved shapes for the socket inserts and/or pusher ends,alone and in combination, are contemplated, including circular,elliptical, spherical, faceted (like a cut jewel) and compound shapesand combinations thereof. It should also be appreciated thatirregularities, such as depressions and/or bumps, may also beintentionally introduced into selected portion(s) of the socket insertsand/or pusher ends depending on the particular DUT profile andconstruction.

FIG. 13E is a perspective view of test socket 1390 and test socketinsert 1392 showing a plurality of suspension support pins 1396, whileFIGS. 13F and 13G are cross-sectional views illustrating a restcondition and a test condition, respectively. In this embodiment, thereare four support pins 1396 along each of the four sides of insert 1392(totaling sixteen support pins) supporting and stabilizing socket insert1396.

Suspension support pins 1396 support socket insert 1392 in an elevatedposition (see FIG. 13F) above the recess surface of test socket 1390 andensures that the one or more spring-loaded test pins 1398 do notprotrude above the top surface of socket insert 1392 during the restcondition. As a result, the top surface of the socket insert 1392 issubstantially smooth and free of any obstructive protrusions, therebyfacilitating the proper alignment and placement of the device 1380 withrespect to the test socket 1390 and the socket insert 1392.

Subsequently, as illustrated by FIG. 13G, during the test condition,after the device 1380 has been properly seated with respect to thesocket insert 1392 and the test socket 1390, the test pin(s) 1398 areexposed to and come into contact with the corresponding pad(s) locatedat the substrate bottom device 1380.

Note that typical DUTs include square DUTs ranging from approximately 14mm square to 50 mm square, and rectangular DUTs ranging fromapproximately 22 mm×25 mm to 24 mm×42 mm. Curvature of a typical DUTdepends on factors such as the size, thicknesses, and/or aspect ratio ofthe substrate and the die. For example, a 50 mm square substrate has aprofile that is about 250 mils higher in the middle of the substratethan the sides of the substrate. In this example, the correspondingsocket insert should have a profile that is about 120 mils higher in themiddle than the sides, thereby substantially reducing the flatteningproblem while allowing the test pins to function within theiroperational compression and expansion range during testing.

Many modifications and additions to the device testers described aboveare also possible. For example, the thickness and/or profile ofdifferent portions of the test socket insert may be varied enabling thesocket insert to flex and conform in a manner (e.g., differentiallyacross the socket insert) thereby generating substantially less overallstress, i.e., less flattening effect, on the DUTs (see the exaggeratedcross-sectional view of FIGS. 13C and 13D). Test socket inserts may alsobe made from materials with a variety of stiffness and/or flexibilitydepending on the DUTs.

It may also possible to fabricate the socket inserts using two or morebonded materials that substantially match the temperature-relatedprofile changes of the DUTs, in a manner similar to a bi-metallic strip,thereby reducing overall stress on the DUTs. Further, test sockets mayalso be heated and/or cooled to minimize temperature differences.

Referring now to FIGS. 14A-14D, are a front view, a top view, aperspective view and a blown-up view illustrating an exemplary heater1460 for some embodiments of the device testers described above. Heater1460 is configured to be operatively coupled to the pedestal of thedevice tester. Heater 1460 may be fused, thermally and/or electrically.For example, as shown in FIG. 14B, heater elements 1464, 1466 are linkedby a fuse 1468, thereby completing a fuse circuit comprising ofconductive lead 1461, heater element 1466, fuse 1468, heater element1464, and conductive lead 1462. Fuse 1468 is located along an open edgeof heater body 1469 and hence can be readily accessed during assembly,reconfiguration and/or maintenance. Exemplary fuse 1468 can be made froma material with a suitable melting point, approximately 300 degreesCelsius, thereby substantially reducing the risk of tester damage and/orfire hazards, such as spontaneous combustion.

In sum, the above embodiments exemplify systems and methods for testingof IC devices such as packaged semiconductor chips while preserving thedevices' original specifications. The advantages include minimizingdeformation of IC devices under test (DUTs) thereby reducing losses dueto physical damage and/or poor contact alignment during subsequentassembly with motherboards.

It will be apparent to those of ordinary skill in the art that theinvention may be embodied in various forms. For example, the materialsused for fabricating the components of the thermal control unit would bereadily apparent to persons skilled in the art upon review of thedisclosure contained herein to ensure that the proper componentfunctioning under the forces and temperatures required for IC devicetesting. Similarly, those of ordinary skill in the art, upon review ofthe disclosure contained herein and through routine experimentation,will be able to distinguish optional versus critical elements of theinvention for different contexts. For example, those of ordinary skillin the art will recognize that the invention may require only one pusherin some instances, but may require a plurality of pushers in other.

It is to be understood that the foregoing description is intended toillustrate and not limit the scope of the invention. For example, whilethe above description has focused on a TCU for IC devices with bare diepackaging, the invention is not limited to such packaging. Accordingly,the above-described pistons, swivelable inlet and outlet arms, andcondensation abating means as described above may be used for TCUsconstructed for testing lidded die packages as well as bare diepackages. In addition, the invention is not limited to force-providingmeans having a construction as shown in the drawing. Those of ordinaryskill in the art, upon review of the disclosure contained herein maydevise various differ force-providing means for receiving a total z-axisforce and controllably distributing the total z-axis force on differentparts of IC packages. In any case, aspects of different embodiments ofthe invention may be included or excluded from other embodiments. Otheraspects, advantages and modifications within the scope of the inventionwill be apparent to those skilled in the art to which the inventionpertains.

An exemplary embodiment of a thermal control unit (TCU) 1500 inaccordance with the present invention is illustrated in FIGS. 15A and15B. Advantages of this embodiment include a fast thermal response ofapproximately 40° C./second for an IC device under test (DUT), having atest surface area of approximately 30 mm×30 mm, and capable of testingover the temperature range of about −60° C. to 160° C.

Another important feature of this embodiment is the use of feedbackmechanism to control the temperature of the device under test (DUT) andkeep it fixed at a substantially stable temperature through out theduration of the testing using the TCU.

As illustrated in FIGS. 15A and 15B, the thermal control unit (TCU) 1500comprises of three main subsystems, namely the fluid management system(FMS) 1600, the thermal head unit (THU) 1700, and the flexible cablechain assembly 1800. The fluid management system (FMS) 1600 provides thesupport and connections to the thermal head unit (THU) 1700 supplying itwith fluid (liquid and gas) for the pneumatic actuation, cooling andtemperature control, and condensation abating. The flexible cable chainassembly 1800 integrates the cables providing the electrical connectionsto the thermal head unit 1700 with the needed cables housed in aflexible chain. The sub-systems 1600, 1700, and 1800 are described indetail below.

The fluid management subsystem 1600 is depicted in FIGS. 16A and 16B. Itis comprised of the inner manifold 1610 and the outer manifold 1620. Themounting towers 1611 provide the mount for the thermal head unit 1700.Each of the mounting towers is supported on three supporting columns1612 which are securely fastened to the TCU base 1613. The U-shapedhoses 1614 carry the chilled cooling fluid and are shaped in a U-shapeto avoid destabilizing the thermal head unit (THU) 1700 during testing.Tubes 1615 carry the Liquid Thermal Interface Material (LTIM) to thethermal head unit 1700. The function of the LTIM is discussed later whenthe details of the thermal head unit 1700 is given. The tubes 1616 and1617 are hooked to the outer manifold 1620. The chilled fluid entersthrough 1616 and leaves the inner manifold 1610 through the tube 1617 tothe outer manifold 1620. The connector 1618 provides an auxiliary inletport for providing dry gas for condensation abating. The connector 1619provides the auxiliary outlet port for the dry gas.

In the outer manifold 1620, the port 1621 is the inlet for the chilledfluid and 1622 is the outlet for the chilled fluid. The port 1623 hooksto the tube 1616 providing the flow of the chilled fluid to the innermanifold. The port 1624 hooks to the tube 1617 the chilled fluid flowsoutward from the inner manifold to the outer manifold 1620. The flow inthe outer manifold 1620 is controlled by the solenoid valve 1625. Thetube 1626 provides inlet-outlet bypass allowing the chilled fluid toflow directly from the inlet port to the outlet port to avoid having astagnant flow in the inner manifold.

The thermal head unit (THU) 1700 is shown in a prospective view in FIG.17A. An exploded view for the thermal head unit (THU) 1700 is depictedin FIG. 17B. The THU is comprised of the connector unit 1701, the fluidcirculation block 1703, the gimbal module 1710, the heater assembly1720, and the device kit module 1730 which is comprised of the pedestalassembly 1740 and the pusher assembly 1750.

The connector unit 1701 is attached to the fluid circulation block 1703.It transfers electrical signals coming from and propagating to theconnector terminal 1702.

In some embodiment, fluid is introduced into and is evacuated from thefluid circulation block 1703 by fluid inlet and outlet connectors 1704and 1705. In operation, the fluid connectors 1704 and 1705 are securelycoupled to the U-shaped hoses 1614 (FIG. 16B) which carries the chilledcooling fluid to the thermal head unit (THU) 1700 during testing.

The gimbal module 1710 (also called the Gimbal) is shown in FIGS. 17C(top view) and 17D (bottom view), it which provides the z-axis forcedenoted by the arrow F that is transmitted to the pedestal assembly 1740and the pusher assembly 1750. The gimbal adapter 1711 is mounted on theforce distribution block 1712 and fits easily in place without the needto use any tools by utilizing the rotary coupler 1713 which is providedwith the quick-release clips 1714. The inlet 1715 provides the pressuredfluid to effect the pneumatic actuation in the gimbal module 1710. Itmay be connected to a source of pressured fluid. Although pressured airis typically used, the pressured fluid may be a gas other than air or aliquid. For example suitable oils, water, or aqueous solutions known tothe skilled in the field, may be used for the pneumatic action. The pins1716 ensure the accurate alignment of the gimbal adapter 1711 relativeto the force distribution block 1712. The quick-release clips 1717facilitate the mounting and dismounting of pusher assembly 1750 easily,in a short time, and without the need to use any tools.

Referring to FIGS. 17C and 17D, the force changing actuator for theforce distribution block can be provided in the form of at least one andpreferably a plurality of pistons 1718 nested in bottom surface 1719 ofthe z-axis force distribution block 1712. Pistons 1718, which arepreferably evenly spaced in a grouping centered in the bottom to theforce distribution block 1712, and can be actuated in the z-axisdirection by altering fluid pressure behind the pistons. Fluid pressureis provided to the pistons from inlet 1715.

The heater assembly 1720 is shown in FIG. 17E. The heater 1721 issupported within the isolator plate 1722. The heater is anelectro-thermal heater where the heat is generated as a result of theflow of electric current flows through a resistance embodied in asuitable material including a ceramic such as aluminum nitride (AlN)which has suitable thermally-conductive properties. The current issupplied through the heater electrical leads 1723. A fuse 1724 isinserted in the resistance circuit. It can be made of a material havinga relatively low temperature melting point such as lead. It protectsagainst temperature runaway. The pins 1725 ensure the alignment of theheater assembly within the thermal head unit 1700. The isolator plate1722 may be made of a material with low thermal conductivity such asplastics. The furrows 1726 are provisions for alignments with the devicekit module 1730.

FIGS. 17 G, 17F, and 17H illustrate the device kit module 1730 and itstwo components; the pedestal assembly 1740 and the substrate pusherassembly 1750. The pedestal assembly 1740 comprises a heat-conductivepedestal 1741 which is having a bottom end configured to contact the dieof the DUT. The top side of the pedestal is in direct contact with theheat exchange plate, known as the cold plate, 1742 which is a thin platemade of copper for its superior thermal conductivity. The cooper in thecold plate 1742 is plated with nickel for durability and oxidationprotection. The cold plate 1742 is surrounded by channels 1743 thatcarry the Liquid Thermal Interface Material (LTIM) to enhance thethermal conductivity between the cold plate 1742 and the heater 1721 andbetween the cold plate 1742 and the heat-conductive pedestal 1741. TheLTIM are fluidly communicated to the channels 1743 through the ports1744.

In operation the cold plate 1742 is configured to be in direct contactwith the heater 1721 on one side and in direct contact with theheat-conductive pedestal 1741 on the other side. The resistive thermaldevices (RTDs) 1745 are the temperature sensors that detect thetemperature of the cold plate 1742 and feed back the detectedtemperature to an external temperature control system (not shown).

The substrate pusher assembly 1750 is configured to contact thesubstrate of the DUT. This pusher assembly 1750 includes a rigid pusherplate 1751 and is suitably fabricated of a metal material, such asaluminum, for rigidity. The bottom pusher plate has a center opening1752 to allow the pusher end of the heat-conductive pedestal 1741 toproject through the pusher plate. The pusher assembly 1750 is springloaded for exerting a z-axis compliant force F to the die of the DUTthrough the heat-conductive pedestal 1741 and to the substrate of theDUT by the rigid pusher plate 175. The pins 1753 hold substrate pusherassembly 1750, the pedestal assembly 1740, and the heater assembly 1720tightly together using the preloaded springs 1754 which are typicallykept under compression. The pins 1753 are aligned with the holes 1746 inthe pedestal assembly 1740 to ensure proper alignment of the device kitmodule 1730. In operation, the pins 1755 align the device kit module1730 to the socket assembly supporting the DUT.

FIG. 171 shows two different configurations for the inner structure ofthe cold plate 1742. To enhance the heat exchange efficiency of the coldplate 1742. In the configuration 1747, the inner structure follows thepattern of a spiral of parallel channels. In the configuration 1748, theinner structure is composed of arrays of micro-channels.

FIG. 17K shows the sectioned 17K-17K (FIG. 17J) through the componentscomprising the thermal head unit (THU) 1700 in stacked relationshipalong a z-axis together with the socket assembly 1760 and the socketinsert 1770 that supports the DUT. The projection of the cablesconnector unit 1701 is followed by the gimbal adapter 1711. The pins1716 ensure the alignment of the gimbal adaptor 1711 in the rotarycoupler 1713. The gimbal adapter 1711 is mounted on the forcedistribution block 1712 and fits easily and uniquely in place withoutthe need to use any tools by utilizing the rotary coupler 1713 which isprovided with the quick-release clips 1714. The pins 1706 provide ahard-stop to the gimbal adapter 1711 in the rotary coupler 1713. Theforce distribution block 1712 has the top cover 1707 that fits in arecess 1708. The channel 1709 is a passageway for the pressured fluid toeffect the pneumatic actuation in the pistons 1718. The piston 1718 iscentered in the bottom to the force distribution block 1712. Connectors1704 and 1705 are the inlet and outlet to the fluid circulation block1703. The chilled fluid is transformed through the fluid passageway 1719imbedded in the fluid circulation block 1703. The heater 1721 is indirect contact on top of the cold plate 1742 which firmly stacked overthe heat-conductive pedestal 1741. The bottom pusher plate has to allowthe pusher end of the heat-conductive pedestal 1741 project through thecenter opening 1752 in pusher plate 1751. The pusher assembly 1750 isspring loaded for exerting a z-axis compliant force F to the die of theDUT through the heat-conductive pedestal 1741 contacting and pushingagainst a thermally active central portion of an IC chip, such as thedie of the DUT 1781 and to the substrate of the DUT 1782 by the rigidpusher plate 1751.

In operation, the temperature of the DUT is maintained at a testspecified value utilizing a temperature feedback mechanism. The RTDsensor 1745, in the thermal control unit (TCU) 1500, sends the value ofthe detected temperature to an external controller which controls bothtemperatures of the heater 1721 and the flow of the chilled fluid. Thetemperature of the heater 1721 is changed by adjusting the electricalcurrent flowing into the heater 1721 through the heater electrical leads1723. The flow of the chilled fluid is controlled by changing theelectrical current flowing into the solenoid valve 1625.

FIG. 18 shows the flexible cable chain assembly 1800, within which theelectrical cables connecting to the thermal head unit (THU) 1700 throughthe electrical connector 1810 having a quick-release feature to connectwithout the use of tools to the connector 1702. Accordingly, the chaincan be an assembly of attached separate segments 1812 to provideflexibility of the chain and thereby substantially enhancing thestability of the thermal head unit (THU) 1700 during testing.

Yet in another embodiment, schemes for abating condensation areprovided. Such methods include a condensation-abating gas inlet andcondensation-abating gas transporting passageways in the thermal headunit (THU) 1700 near surfaces of the thermal control unit (TCU) 1500 onwhich condensation may occur. Another means for abating condensation1900 is depicted in FIGS. 19A and 19B. The thermal control unit (TCU)1500 is enclosed in two dry boxes 1910 and 1920 they provide a containeddry environment filled with condensation-abating gas. The smaller box1910 covers the thermal head unit (THU) 1700 and the larger box 1920contains the dry environment around the fluid management system 1600.

It is be noted that in testing integrated circuit (IC) the device undertest (DUT) can be a substrate having multiple IC chips having differentheights and testing requirements in terms of forces applied andtemperatures of testing. One embodiment of a compliant pedestal isherein described.

As shown in FIG. 20, a DUT 2000 has at least two IC chips 2040 and 2060on a multi-chip substrate 2020, An IC chip 2040 has testing requirementsin forces applied and temperatures of testing that are different formtesting requirements in forces applied and temperatures of testing of anIC chip 2060 which is on the same multi-chip substrate 2020. For thisreason a pedestal assembly 2100 shown in FIG. 21, would be beneficial intesting the multi-chip substrate 2020. The pedestal assembly 2100 has atleast two separate pedestals: a compliant pedestal 2140 and a stationarypedestal 2160, housed in a pedestal support 2110 which is founded upon apedestal base 2120. The compliant pedestal 2140 can be spring loaded orfluid actuated and configured to be contacting the IC chip 2040, whilethe stationary pedestal 2160 is of fixed height and is configured tocontact the IC chip 2060 during simultaneous testing of both the ICchips 2040 and 2060.

FIG. 22 shows the pedestal assembly 2100 with an exploded view of thecompliant pedestal 2140. The compliant pedestal 2140 is comprised of acompliant pedestal head 2210 terminated by a contacting surface 2240which is configured to be in direct contact with the DUT during testing,an O-ring 2220, and multiple coil springs 2230.

The O-ring 2220 keeps compliant pedestal head 2210 aligned within thebore of the pedestal support 2110 and serves as a seal to keep anythermal compound used to enhance heat conduction in the compliantpedestal 2140 from leaking.

The multiple coil springs 2230 are configured to apply a specified forceto the compliant pedestal 2140 to ensure that the force exerted by thecompliant pedestal 2140 to an IC chip, it is configured to contact, isthe required force for this specific IC chip. The spring action of themultiple coil springs 2230 ensures that the compliant pedestal 2140returns to its unloaded position after the test is completed.

The temperature of both the compliant pedestal 2140 and the stationarypedestal 2160 is controlled by an external temperature control system(not shown). A resistive thermal device (RTD) 2250 is a temperaturesensor that detects the temperature of the pedestal assembly 2100 andfeeds back the detected temperature to the external temperature controlsystem.

The RTD 2250 is surrounded by an O-ring 2260 which helps center the RTDin its receptacle hole (not shown) in the pedestal assembly 2100 andprotects the RTD 2100 from unnecessary strain from thermal expansion ofthe potting material. The signal from the RTD is transmitted through acable 2290.

The compliant pedestal 2140 is supported by a screw 2270. The screw 2270travels with the compliant pedestal 2140. Another function for the screw2270 is to define the unloaded position of the compliant pedestal 2140after the test is completed. This position is determined by choosing theprecise length of the screw 2270.

The screw 2270 is situated in a screw cover 2275, which is fastened intothe pedestal base 2120 using at least two retaining screws 2280.

In order to clarify the details of the pedestal assembly 2100 further,we include FIGS. 23, 24A, 24B, and 24C.

FIG. 24A shows detailed view of a section into the pedestal assembly2100 along the line 24A-24A in FIG. 23. A hole 2410 in the pedestalsupport 2110 provides a path for a fluid such as compressed gas toactuate the motion of the compliant pedestal 2140. A tight space exists(not shown) between the outer surface of the compliant pedestal 2140 andthe inner surface of the pedestal support 2110. To ensure good thermalconduction and smooth movement of the compliant pedestal 2140, a thermalcompound (not shown) can be provided in this tight space. An example ofthe thermal compound that can be used is thermal grease.

FIG. 24B shows detailed view of a section into the pedestal assembly2100 along the line 24B-24B in FIG. 23. Two of the coil springs 2230 areshown in the unloaded position (rest position). Also shown in FIG. 24B,is the external part of the cable 2290 which transmits the signal fromthe RTD to the external temperature control system (not shown).

FIG. 24C shows detailed view of a section into the pedestal assembly2100 along the line 24C-24C in FIG. 23. This cross-section cuts intoboth the compliant pedestal 2140 and the stationary pedestal 2160. FIG.24C illustrates how the screw 2270 is situated in the screw cover 2275,which is fastened into the pedestal base 2120 by the least two retainingscrews 2280.

It is to be noted that the in some IC testing, the temperaturerequirements of testing different IC chips on the same multi-chipsubstrate can be different. In the exemplar case described above, the atleast two IC chips 2040 and 2060 on the multi-chip substrate 2020 canhave different testing temperature requirements. For this reason, thecompliant pedestal 2140 can have a temperature control system separatefrom the temperature control for the stationary pedestal 2160. Abeneficial alternative to the embodiment of the pedestal assembly 2100,described above is to have separate RTD's for each of the pedestals, thecompliant and the stationary.

It is to be noted that because the pedestal is kept in contact with anIC during testing, the contact surfaces of the pedestal and the IC mayadhere to each other and present some difficulty in disengaging at theend of testing. This adhesion between the contacting pedestal and the ICcan result from the fact that some tests require the application of aforce during testing, e.g., to ensure reliable electrical contact(s).Moreover, some IC tests are done at elevated temperatures which canexacerbate any surface adhesion problem. Condensation due to rapidtemperature changes of the pedestal and IC may also contribute to theadhesion problem.

Accordingly, in yet a further embodiment the pusher assembly 1750 (shownin FIGS. 17C and 17D) is provided with ejection mechanisms to facilitatethe disengagement of the DUT at the end of the test.

One exemplary embodiment of the ejection mechanisms is to provide thepusher assembly used in conjunction with the pedestal with spring-loadedpins that push the substrate of the DUT away from the pedestal at theend of the test.

FIG. 25 shows a perspective view of a pusher assembly 2500. A pusherbase 2510 supports a pusher extension 2520. The pusher extension 2520has an opening 2530 to accommodate a pedestal (not shown). A set ofejection pins 2540 are provided as part of the ejection mechanism.

FIG. 26 shows an exploded view of the pusher assembly 2500 together witha device under test (DUT) 2550. The set of the ejection pins 2540 areloaded with a set of springs 2542. The pusher extension 2520 is coupledto the pusher base 2510 by a set of screws 2544.

FIG. 27 shows a top view of the pusher assembly 2500 together with adevice under test (DUT) 2550. A cross-sectional view along the line A-Ain FIG. 27 is shown in FIG. 28. The spring-loaded ejection pins 2540 arein contact with the device under test 2550 during the test. Duringtesting, the substrate of the device under test (DUT) 2550 is heldagainst the pusher assembly 2900 by forces (not shown) specified by thetest requirements e.g., to ensure reliable electrical contact(s). At theend of the test, these forces are not exerted any more on the substrateof the device under test 2550 and the spring-loaded ejection pins 2540push against the substrate of the DUT and hence achieving thedisengagement of the DUT at the end of the test.

It is to be noted that some alternatives to the spring-loaded ejectionpins 2540 can be used. Examples of the alternatives that can beimplemented are the use of plungers alongside with electromagneticrelays. At the end of the test, the electromagnet can be activated byfeeding electrical current into it and thus pushing the plungers againstthe substrate of the DUT and hence achieving the disengagement of theDUT. Another similar alternative to the use of the spring-loadedejection pins 2540 is to use electrostatic actuators that be energizedby applying certain specified voltages. Utilizing ultrasonic vibrationsto accomplish the disengagement of the DUT can also be usedalternatively.

Yet another exemplary embodiment of the ejection mechanisms is to use apressurized fluid blasting from multiple ejection nozzles to push thesubstrate of the DUT away from the pedestal at the end of the test.

FIG. 29 shows a perspective view of a pusher assembly 2900. The pusherbase 2510 supports the pusher extension 2520. The pusher extension 2520is provided with a set of ejection nozzles 2920 carrying pressurizedfluid as part of the ejection mechanism. The pressurized fluid is fedinto the pusher base 2510 through openings 2940.

FIG. 30 shows an exploded view of the pusher assembly 2900 with the setof ejection nozzles together with a device under test (DUT) 2550. Thepusher extension 2520 is coupled to the pusher base 2510 by a set ofscrews 2544.

In order to describe the use of pressurized fluid blasting in thesubstrate ejection mechanism, we consider a cores-sectional view of thepusher assembly 2900 with the set of ejection nozzles. FIG. 31 shows atop view of the pusher assembly 2900 together with a device under test(DUT) 2550. A cross-section is taken along the line A-A. The resultingcross-sectional view is shown in FIG. 32. In one exemplary pressurizedfluid blasting embodiment, the pressurized fluid is fed into the pusherassembly 2900 through the openings 2940 and guided through thehorizontal tubes 2930 and then through the vertical tubes 2910 whichlead to the blasting nozzles 2920.

During testing, the substrate of the device under test 2550 is heldagainst the pusher assembly 2900 by forces (not shown) specified by thetest requirements e.g., to ensure reliable electrical contact(s). At theend of the test, these forces are not exerted any more on the substrateof the device under test 2550. The blast of the pressurized fluidexiting from the ejection nozzles 2920 can be adjusted to have enoughthrust to push away the substrate of the device under test 2550 from thepusher assembly 2900 and thus achieving easily the disengaging of theDUT at the end of testing.

The amount of thrust or force resulting from the blast of thepressurized fluid exiting from the ejection nozzles 2920 can be variedaccording to the characteristics of the device under test 2550. This canbe done by controlling the pressure of pressurized fluid, changing theorifices of the ejection nozzles 2920, or utilizing different fluids.Also a combination of these options can be implemented to reach theamount of thrust needed to disengage a given DUT.

Examples of pressurized fluid that can be used in this exemplaryembodiment are compressed air, pressurized Nitrogen gas, a liquid, etc.

The thermal control unit (TCU) is used in testing a Device Under Test(DUT) which normally includes a die attached to a substrate. The dieincorporates an integrated circuit (IC) or multiple of ICs. The die isbonded electrically and physically to the top of the substrate, at anelevated temperature sufficient to melt bonding material and to cure it.

FIG. 33 shows three conditions of the DUT 3310. Initially, the die 3311and the substrate 3312 are flat before being bonded to each other, asshown in configuration A of the DUT 3310 in FIG. 33. However during thecooling process after a heated bonding process, the DUT becomes slightlycurved as a result of mismatch in thermal expansion and contractioncoefficients between the die and the substrate. Thus, when the DUT coolsthe substrate warps resulting in the configuration B of the DUT 3310 inFIG. 33, representing a convex shape or simply a ‘sad face’ shape.

The curvature of the device at room temperature (after cooling),represented by B of the DUT 3310 in FIG. 33, should not be a problembecause during a downstream assembly of the device to a motherboard, atan elevated reflow temperature (sufficient to melt solder paste) insidea reflow oven, the reheated device should become substantially flatagain, thereby ensuring satisfactory electrical bonds between the devicepads and the motherboard contacts.

If the DUT gets flattened during testing using a convention thermalcontrol unit (TCU), the downstream assembly processes will be morecomplicated because when the package is heated back to highertemperatures to reflow soldering material, the shape becomes a ‘smileyface’, or concave as represented by configuration C of the DUT 3310 inFIG. 33. This configuration can cause soldering issue that can result inlosing some electrical connectivity.

Ideally, the convex curvature of the DUT, represented by B of the DUT3310 in FIG. 33, should be preserved prior to assembly to themotherboard. However, these devices need to be tested for properfunctionality at different temperatures prior to assembly to themotherboard.

A conventional testing stack 3400 of a TCU for testing integratedcircuits is shown in FIG. 34A. The conventional stack 3400 is comprisedof a DUT 3310, a conventional socket structure 3420, a mother board3430, a set of insulation posts 3440, and a support plate 3450. The DUT3310 is comprised of the die 3311 and the substrate 3312. The DUT is3310 slightly curved with a convex curvature (slightly bowed like thetop of a mushroom).

FIG. 34B depicts an exploded view of the conventional testing stack3400, described above. It is to be noted that the height of the set ofinsulation posts 3440 is kept uniform between all the posts, resultingin flat support to the rest of the conventional testing stack 3400.

The configuration of the conventional testing stack 3300, shown in FIG.34A, is positioned during testing to receive a z-axis force F asindicated in FIG. 34A. The combination of the force F and the flatassembly stack would result in a flattened DUT 3310. If the DUT getsflattened during testing using the convention testing stack 3300, thedownstream assembly processes would suffer complications resulting inthe risk of loss of electrical connectivity as described above.

In one embodiment of this invention, the testing stack 3300 is modifiedto preserve the convex shape of the DUT 3310.

It is to be noted that the convex curvature of the DUT 3310 can be inthe two dimensions of the plane of the die 3311 and the substrate 3312.FIG. 35 is a representation of convex curvatures in both the x-directionas well as the y-direction. It is further to be noted that radius ofcurvature in the X-direction (R_(X)) can be different from the radius ofcurvature in the Y-direction (R_(Y)) depending on the shape anddimensions of the die 3311 and the substrate 3312.

According to this embodiment of the invention that aims at preservingthe convex shape of the DUT 3310, a convex set of insulation posts 3640is made of posts of different heights to form a convex shape 3645, asdepicted in FIG. 36A.

A convex testing stack 3600 for testing integrated circuits is shown inFIG. 36B. The convex stack 3600 is comprised of a DUT 3310, the socketstructure 3620, the mother board 3630, a convex set of insulation posts3640, and the support plate 3650. The convex set of insulation posts3640 and the support plate 3650 form a convex support plate assembly.

The configuration of the convex testing stack 3600 thus preserves theconvex shape of the DUT 3310 even under the z-axis force F exerted onthe DUT in the configuration of the convex testing stack 3600 asindicated in FIG. 36B and avoids the undesirable flattening of the DUT3310.

It is to be noted that according to this embodiment, the heights of theconvex set of insulation posts 3640 can be adjusted in both theX-direction and the Y-direction in order to match the radii ofcurvatures of the DUT 3310, depending on the shape and dimensions of thedie 3311 and the substrate 3312.

It is further to be noted that according to this embodiment, the convexset of insulation posts 3640 can be configured to comply with the ICmanufacturer's specifications characterizing the amount of curvaturerequired or allowed by the IC manufacturer by adjusted the heights ofdifferent posts of the convex set of insulation posts 3640.

Hence, while this invention has been described in terms of severalembodiments, there are alterations, modifications, permutations, andsubstitute equivalents, which fall within the scope of this invention.It should also be noted that there are many alternative ways ofimplementing the methods and apparatuses of the present invention. It istherefore intended that the following appended claims be interpreted asincluding all such alterations, modifications, permutations, andsubstitute equivalents as fall within the true spirit and scope of thepresent invention.

What is claimed is:
 1. A convex testing stack useful in association witha thermal control unit (TCU) that may be used to maintain a set pointtemperature for testing of a convex IC device under test (DUT), theconvex testing stack comprising: a substantially convex support plateassembly configured to provide support to the convex testing stack; aconforming motherboard configured to take a convex shape whenoperatively coupled to the convex testing stack; and a conforming socketassembly configured to take a convex shape when operatively coupled tothe conforming motherboard.
 2. The convex testing stack of claim 1wherein the convex support plate assembly is comprised of a flat supportplate and a convex set of insulation posts.
 3. The convex testing stackof claim 1 wherein the convex set of insulation posts can be configuredto have different curvature radii to match the curvature of the convexIC device under test (DUT).
 4. The convex testing stack of claim 1wherein the convex set of insulation posts can be configured to havedifferent curvature radii complying with specifications of amanufacturer of the convex IC device under test (DUT).
 5. The convextesting stack of claim 1 wherein the convex set of insulation posts canbe configured to have different curvature radii in two dimensions tomatch the two dimensional curvature of the convex IC device under test(DUT).
 6. The convex testing stack of claim 1 wherein the convex set ofinsulation posts can be configured to have different curvature radii intwo dimensions to complying with two dimensional curvaturespecifications of the manufacturer of the convex IC device under test(DUT).